Smart packages systems and methods

ABSTRACT

Various smart package configurations may include a package intelligence and communication module (PICM) intelligently interacting with smart heating appliances and users. A thermodynamic load profile may correlate thermodynamic response characteristics of the package and be stored in or associated with a unique identifier in the PICM. The TLP enables efficient and safe heating of packages on a smart appliance as well as package validation and authentication. Package configurations also include structural elements for efficient heating of food, beverage, cosmetic and personal care products.

PRIORITY CLAIM AND REFERENCE TO RELATED APPLICATIONS

This application claims priority and benefit under all applicable laws,treaties and regulations, to U.S. provisional application Ser. No.62/478,000 filed on Mar. 28, 2017, titled “SMART PACKAGES AND SMARTPACKAGE APPLIANCES,” the subject matter of which is incorporated hereinby reference in its entirety. Where an element or subject matter of thisapplication or a part of the description, claims or drawings in theaforementioned provisional application is not otherwise contained inthis application, that element, subject matter or part is incorporatedby reference in this application for the purposes of any and allapplicable rules, procedures or laws.

BACKGROUND 1. Technical Field

The disclosure relates to smart or intelligent packages containingpackaged contents. Such contents may include consumable products, suchas food products, beverages, liquids or liquefiable materials, cosmeticproducts and personal care products. The terms “smart” or “intelligent”as used herein may refer to information storage, processing andcommunication features and capabilities that enhance operation andenable interfacing with users and with other devices, such assmartphones or external computers. The disclosure also relates to smartpackaging, which may also include elements and features to supportinformation storage, processing and communication. The disclosure alsorelates to smart appliances, systems an methods of operation for heatingsmart packages. Such appliances may include induction heating stoves,cooktops, cookers and ranges.

The disclosure also relates to devices, systems and methods formonitoring and controlling the heating experience of a package and/orits contents. Heating “experience” refers to the heating processundergone by a package and/or package contents during a heatingoperation. The disclosure also relates to control systems for ensuringthat safety standards are adhered to during the heating process and thatsafety measures relating to post-heating consumption are followed (i.e.,avoiding high temperature of food, beverages, cosmetics or personal careproducts that could injure a consumer). The disclosure further relatesto systems for communicating and analyzing data and other informationrelated to package heating and generated prior to use, during use andafter use and or during heating.

The disclosure also relates to devices, systems and methods forvalidating the integrity of packages and packaged content, such asvalidating that a package is properly constructed and contains theproper amount of product, prior to or during a heating operation. Thedisclosure also relates to devices, systems and methods forauthenticating packages and packaged content, such as ensuring that apackage and packaged content are genuine and truly originate from aknown source or provider.

2. Prior Art

Energy transfer and heating or cooking appliances, such as inductioncooking appliances, are generally well known in the prior art. Suchsystems involve a heating element that transfers energy, typically byinduction, to a receptor or cooking vessel which ultimately results inheating of package contents. Moreover, automated cooking systems andpackaging systems that utilize energy transfer components, such asmicrowave popcorn packaging with an internal heating element, aregenerally known. However, known energy transfer appliances, systems,packaging systems and automated control systems utilized with suchsystems suffer from a number of drawbacks.

For example, in the past automating cooking appliances do not adequatelycustomize the appliance heating function to the requirements of thepackage contents. Known solutions rely on human operator input to setthe programming for the heating appliance based on knowledge of what isto be heated, such as amount of content, water content, desired cookingtemperature, starting temperature, etc. All of these factors and othersinfluence the cooking process and energy to be delivered to the packagecontents. For example, a present problem with induction cooking is thatan induction range will apply the same process for energy transfer toheat any object that is conductive and is on conductive surface,regardless of the specific heating requirements for the package contentsor contents within a cooking vessel. In other words, any device that canbe inductively heated will be heated. For example, in the pastmicrowaves may typically use 1500 watts to heat a small bag of popcorn,whereas the actual energy requirements for properly cooking the contentsis only 60 watts. Thus, precise control of energy transfer, tailored tospecific contents, offers the opportunity for dramatic energy savings.An additional drawback of the prior art is that known microwavepackaging does not facilitate control to limit or adjust energy tocompensate for foreign objects in the heating field, or to anticipatesafety issues that may arise by heating unwanted objects in the field.

Other known issues with previous solutions are that they are notautomated and controlled based on specific contents, and they do notlimit the risk of unattended usage appropriately. Enabling theadditional understanding by an appliance of package safety limits,experience set points, user set points and to deliver a controlledcooking experience for packages and contents would vastly improve knownappliances. An example of this is cooking in a metal pan with aninductive range. The type, amount and condition of ingredients usedcreate variables to the cooking process undergone by the ingredients—thecooking experience. Unless they are exactly measured and exactly thesame, the cooking experience will vary by some degree. Thus, determiningand understanding the energy requirements of a particular productpackage and package contents and efficiently controlling cooking energyhas been a challenge.

Another issue with prior art solutions relates to the lack of adequatepackage/product validation—the ability to determine whether or not apackage and contents have an assumed level of integrity. And stillanother issue relates to the lack of adequate package/productauthentication—the ability to determine whether or not a package andcontents truly originate from a legitimate and known source. Packagevalidation and authentication may be vital to verifying the operationaland functional characteristics of a package to be heated. Suchverification can be important if improved operation, such as support forunattended or remote operation of a heating appliance to heat a packageis to be provided. Some prior art solutions control heating based onsensing parameters. For example, some prior art solutions may controlheating based on a change in impedance in heated materials. For furtherexample, other solutions, such as those provided by Hestan Cue, includesmart cooking systems in which temperature and time of a cooking pan maybe automatically set. However, such systems do not control based on apredefined or pre-modeled thermodynamic load of a heated package andsuffer from a number of other shortcomings and disadvantages.

Still further, prior art packages lack structures that provide forefficient and effective heating and that are cost-effective to massproduce.

SUMMARY

Aspects of the disclosure provide smart packaging to facilitate improvedcontrol of energy delivered to package contents and improved efficiencyand safety of the heating operation experienced by the package andpackage contents. The smart packaging may include a package intelligenceand communication module (PICM), which includes a machine-readableelement, such as an RFID tag or other near field communication (NFC)element, including a light-energized microtransponder, that can storeand transmit a unique identifier, such as an electronic serial number(ESN), that may be pre-associated with a particular smart package andcontents, and/or an instance thereof (i.e. a certain one of a type ofsmart package). The thermodynamic response characteristics of thepackage may be modeled during a testing/calibration operation as part ofthe manufacturing process. Package size and weight, composition andcontent amounts may be standardized in order to maintain a predictableand repeatable thermodynamic response across a manufactured lot ofproduct and packaging. Data representing correlations of parameters thatrepresent the package's thermodynamic response characteristics may bestored within the PICM or stored in remote databases and retrieved basedon the package unique identifier when the package undergoes a heatingoperation on a smart appliance. The smart appliance may include anenergizing unit for applying energy to the package contents; a packageinterface for interacting with the package intelligence andcommunication module, the package interface including: a transmitter fortransmitting a signal to the package intelligence and communicationmodule; and a receiver for receiving the package-content related data;the energizing unit including a control subsystem, including a processorfor controlling the energy applied to the package contents based on thecontent-related data. These features enable not only efficient packageheating but package validation, authentication and safety.

According to an aspect of the disclosure, the smart package may includea light-energized microtransponder (LEM) such as microtranspondersmanufactured under the name P-CHIP® by Pharmaseq Corporation of MonmouthJunction, N.J., USA. LEM's are of a small size compared to RFID tags andtherefore permit placement on packaging without significant modificationof the package structure, as well as other advantages. The appliance mayinclude an integrated P-CHIP® reader, which reads the information fromthe smart packaging and permits a control system to provide appropriatecontrol of the cooking process to provide safe and efficient heating.Aspects of the disclosure enable a new level of control of energydelivered to contents, such as food, beverages, or cosmetics or personalcare products and an improved heating experience delivered to thepackage and contents and for users.

According to another aspect, example packages may utilize data setsassociated with a unique product identifier and thus the smart packageand contents to control package heating operations and to validate andauthenticate packages. The data sets may be stored on a PICM orretrieved from local or remote databases in a wide area network (i.e.,cloud) based on a unique package identifier obtained from a reader onthe appliance. The data sets may include respective thermodynamic loadprofiles (“TLP's”) for different packages to be heated. The TLP's mayinclude data representing correlations of thermodynamic and otherparameters established during a previous manufacturing, calibration ortesting step. The TLP may correlate data representing, for example,frequency and field voltage related to mutual inductance, currentrelated to power such as the voltage and current at a frequency relatedto the expected information provided by and read from the package over aspecific time sequence. Because package contents can be repeatedlyfilled into a package by the manufacturer with a high level of accuracy,and the parameters of the package are also known, this information canbe predefined, preconfigured and characterized to deliver specific andrepeatable experiences. The retrieved information may be used to informcontrol systems on the appliance, according to other aspects of thedisclosure, to provide an improved cooking/heating process for thepackage contents. Power consumption of heating appliances may be reducedthru more efficient and precise control of cooking operations. Data setsretrieved by the appliance over a wide area network or locally may beutilized to efficiently control or validate energy transfer operations.The data sets may include information regarding the energy response ofthe contents, including how the contents within the package or vesselrespond to energy over time and for a range of ambient temperatures. Forexample, for food contents, such as oatmeal, requiring the addition of aliquid, such as water, the energy response of a package being heated canbe compared to a stored normal response for a given ambient temperature.If, for example, the package temperature increases faster than thenormal response, a determination can be made that insufficient water wasadded to the package and the user can be notified via a user-interface,such as a display on the appliance. In addition, the energy applied tothe package can be limited to prevent unsafe conditions, such as packageor content temperatures increasing to an unsafe level. It should also benoted that the limits and variations of the packaging manufacturer alsobecome part of these parameters. If the packaging manufacturer has abest case 7% fill accuracy, that may build into the thermodynamicprofile as an error percentage.

According to another aspect of the disclosure, product-identifying datamay be utilized on smart packaging to authenticate product packaging andcontents and improve product and heating safety. Authentication may beimproved by combining the product identifying data obtained from aproduct package with pre-stored actual performance criteria andoperation data profiles. A manufacturer of the authentic food, foodpackage other product can determine a precise heating/energy responseprofile for that specific product. The response from a smart applianceduring a validation or authentication operation will be dependent uponthe precise composition of the authentic food product. Databases mayassociate the smart package identifying information with parametersrelating to authenticity, including the energy response, as well asparameters relating to product freshness and heating profiles, includingprofiles for various ambient conditions. A smart heating appliance mayretrieve this information via network for a particular package serialnumber or other identifying information. The smart package identifyinginformation read by the appliance may be used to authenticate thelegitimacy and quality of the product, protect against counterfeit orsub-standard products, identify products that are part of a recall, andensure that any expiration date has not passed. For example, if amachine-readable tag, such as an RFID tag, is placed on a counterfeit orsubstandard product, appliances according to an aspect of the disclosuremay detect this based on deviations of the heating profile of thecounterfeit product compared to the profile known to be associated witha legitimate product and/or package.

To improve safety, the control system may sense any deviation, even asmall deviation, and in response may cause a fault condition compared tospecified operating parameters, which in turn will initiate suitablecontrol steps, such as shutting off the heating power. A package designsystem is employed to measure and assure temperatures, measure powerlevels and offsets, recording and testing the package operatingcharacteristics over usage. It is this test system used by the packagemanufacturer that sets the experience criteria and logs the operatingtransforms and safety limits. By monitoring and controlling deliveredheating energy very closely, the system and packaging, according toaspects of the disclosure, may provide safe, preconfigured andcontrolled cooking/heating processes and cooking/heating experiences forthe user. Stored profiles may include temperature profiles (temperatureover time) and may include minimal liquid temperature, maximum liquidtemperature, ideal profile, max material safety profile (surface andpackage) time and temperature, stir times, altitude offsets and ambienttemperature offsets. Material safety properties may change over time andbased on the materials database these parameters may shift as additionalknowledge is gained.

According to aspects of the disclosure, various smart package structuresare provided to facilitate improved heating for personal care, homecare, cosmetic, food and beverage products.

According to an aspect of the disclosure, smart packaging is providedwith an insulating layer or spacer for an inductive element. Thispermits higher temperature heating and materials to be used andincreased safety.

According to an aspect of the disclosure, smart packaging structures mayutilize liquid components of a food product or heating/steaming material(water) for insulating an inductive receptor.

According to an aspect, smart packaging may utilize controlled steamingin a steamer package for improved preparation of food products or otherproducts using water or other vapor.

DESCRIPTION OF THE DRAWINGS

The above and other attendant advantages and features of the inventionwill be apparent from the following detailed description together withthe accompanying drawings, in which like reference numerals representlike elements throughout. It will be understood that the description andembodiments are intended as illustrative examples and are not intendedto be limiting to the scope of invention, which is set forth in theclaims appended hereto. The following FIGURES, unless otherwise noted,depict example devices according to aspects of the disclosure.

FIG. 1 is a block diagram of components and their functionalrelationships for a smart appliance and smart package.

FIG. 2 is a block diagram of data sets and a data architecture that maybe used by a smart appliance.

FIG. 3 illustrates a data correlations in a thermodynamic load profilefor controlling an example smart appliance.

FIG. 4 is a logic flow diagram for a smart appliance for controlling theheating of a smart package.

FIG. 5 is a smart package and smart appliance for brewing and heatingtea.

FIG. 6 is a logic flow diagram for operating a smart appliance in a teabrewing and heating operation.

FIG. 7 is a schematic diagram of a smart package and smart applianceutilizing a light powered microtransponder and reader.

FIG. 8 is a schematic diagram of another example smart package and smartappliance utilizing a light powered microtransponder and reader.

FIG. 9 illustrates an example heating coil configuration that allowsheating distance or powering through surfaces for packages.

FIG. 10 illustrates another example of heating coil configuration thatallows extra heating distance between the coil and receptor.

FIG. 11 illustrates example elements of a smart package system includinga package, NFC chip with temperature sensor, a receptor of metalmaterial and the spacer that allows the fluids within the package tooperate as a simple insulator.

FIG. 12 illustrates an example smart package in the form of a metal canwith a shielded NFC tag that allows both heating and reading of the tag.

FIG. 13 illustrates an example smart package with a side mounted NFC tagthat can wrap all the way around the package, which may be a metal can.

FIG. 14 illustrates an example smart package that has a receptor andsmart sensor built into the vessel.

FIG. 15 illustrates an example reusable smart package that may include asmart cup sleeve for insulating and/or heating.

FIG. 16 illustrates an example smart package that utilizes the heatingpuck that may be dropped into the contents of the package forintelligent heating.

FIG. 17 illustrates another example heating puc with a clip forconnection to the side of a container.

FIG. 18 illustrates another example smart package in the form of a Bentobox or compartmentalized tray.

FIG. 19 illustrates another example smart package in the form of acompartmentalized tray.

FIG. 20 illustrates an example smart package in the form of a popcorncup with a peel-off lid and secondary peel-off vent.

FIG. 21 includes exploded views of a smart packages in the form of apopcorn bag and a personalized cup.

FIG. 22 illustrates an example smart package in the form of a coffee ortea maker.

FIG. 23 illustrates an example smart package in the form of the candleor wax package as well as an appliance for simulating a candle.

FIG. 24 illustrates two additional example wax package configurationsand appliances.

FIG. 25 illustrates four different smart package configurations that maybe used with a single smart heating appliance.

FIG. 26 illustrates a mobile device and example mobile application anduser interface for monitoring and controlling heating of a number ofdifferent smart packages.

FIG. 27 illustrates an example information exchange scheme for use withsmart packages.

FIG. 28 illustrates and example coated metal stamping for directingfluid and stirring fluid contents in a smart package configuration.

FIG. 29 illustrates another example of a metal stamping that includes achimney or internal tube for directing fluid.

FIG. 30 illustrates an example smart package with tuned materials andwhich allows an NFC tag to be read from the bottom side in the receptorwere to be heated with a lower frequency inductive source.

FIG. 31 illustrates the smart package with the metal composition thatmay be used with a multiple coil appliance for a rapid heatingapplication.

FIG. 32 is an illustration of a package that includes a two-partassembly which defines an internal air or vacuum gap for insulating acooking surface.

FIG. 33 illustrates an assembled and exploded view of a package thatincludes a heating cap that may be removably attached to a bottle.

FIG. 34 illustrates an alternative package that includes a heating capthat may be removably attached to a bottle.

FIG. 35 illustrates an exploded view of an alternative package thatincludes a P-chip.

FIG. 36 illustrates a smart package and appliance with a decorativelighting feature.

FIG. 37 illustrates further details of a tea/coffee tumbler as describedabove with reference to FIGS. 5 and 6.

FIG. 38 illustrates an inductively heated vessel with a coffee pour overkit.

FIG. 39 illustrates an example package configuration in the form of aself-contained inductively heated coffee pour over kit.

FIG. 40 illustrates an example package configuration in the form of acontainer having a conductive internal vessel that is insulated from anouter shell by an air void.

FIG. 41 illustrates a package configuration for steaming food products.

FIG. 42 illustrates an inductive popcorn popper having an inverted glassor plastic jar with a threaded neck.

FIG. 43 schematically illustrates components of a light-poweredmicrotransponder suitable for use with packaging described herein.

FIG. 44 illustrates components of a photo- or light-poweredmicrotransponder suitable for supporting a PICM according to aspects ofthe disclosure

FIG. 45 is a schematic diagram showing the interaction between examplesystem components to achieve validation, authentication and safety.

FIG. 46 shows an example security solution and chain of communicationapplicable to validation and authentication data.

FIG. 47 is an example logic flow for validation and authentication by anexample appliance.

DETAILED DESCRIPTION

FIG. 1 is a block diagram of example components and their functionalrelationships for an example smart appliance and smart package. Thesmart package 100 may be a sealed package having a tamper-proof lid. Thesmart package 100 may include a package intelligence and communicationmodule (PICM) 106, which may include a transponder 110 having a storageor memory 112 containing a stored unique identifier, such as anelectronic serial number (ESN), and other data previously stored duringa package manufacturing, test, calibration or initialization operation,as will be explained. A temperature sensor 120 may be disposed on orwithin the smart package 100. The smart package 100 may include aninductive receptor 130 and an insulating spacer 140 disposed therein.

According to an aspect of the disclosure, the transponder 110 may be anear-field communication tag, or more particularly, an electromagneticenergy (EME) energized RFID tag, or may be a light-energizedmicrotransponder (“LEM”), such as the semiconductor product marketedunder the name P-CHIP® by Pharmaseq, Inc., of Princeton, N.J. Suchmicrotransponders have a small size, typically 500×500 microns andnominally 100 microns thick—and may store a unique serial number (ID)which is transmitted in response to energization of photocells on themicrotransponder by received light, such as pulsed laser light.Light-energized microtransponders offer advantages over electromagneticenergy (EME) powered RFID tags, including lower cost and elimination ofinterference from surrounding metal, such as packaging materials (i.e.,metal cans). As such LEM's do not require a coil for generating power,their size is dramatically reduced compared to RFID tags and permitsembedding of the microtransponder in packaging elements, such ascontainer caps and package bottoms.

According to an aspect of the disclosure, RFID or NFC tags, or anysimilar device with an inductive antenna that generates current, can beused to harvest energy from an external source, such as fromelectromagnetic pulse energy received from a reader, and use the energynot only to power the transponder but to power other components in thesystem. For example, any excess power available from the inductiveantenna can be used to additionally power other sensors in the system,such as sensors for pressure, temperature, tamper seals, and moisturesensors. The RFID or NFC chip harvests power and be configured inconjunction with a small microprocessor that may communicate with andcontrol other components to deliver excess harvested power additionalsensors. Energy may be stored in a small storage device integrated intothe PICM 106. The use of extra available power harvested from the RFIDor NFC components can be used to ensure other components, such assensors, such as temperature sensor 120 of PICM 106, or other sensors,such as pressure sensors that may be included in a package and thatrequire power, may operate more dependably and with the overall systemhaving more stability than in cases where power available to the sensorsis in short supply or interrupted. Temperature sensors may be used tocontrol package heating according to preset thresholds, for example.Pressure sensors may be used to control a heating operation involvingsteaming and an internal package pressure. Components may communicateusing known protocols or interface, such as I2C, also known as “ISquared C” is used interface to one or multiple sensors based on therequired experience.

Still referring to FIG. 1, an example smart package heating and chargingappliance (SPHCA) 200 may cooperate with the smart package 100 to heatthe contents thereof. SPHCA 200 may include a reader 210 forcommunicating with the transponder 110 via radio-frequency. As will beexplained further herein, the reader 210 may incorporate an opticalsimulator (pulsed laser) or an RF simulator to energize transponder 110.Transponder 110 may respond with an RF signal representing a uniqueidentifier stored in storage 112 and other stored information. SPHCA mayfurther include an integrated light harvesting circuit using an (I2C)interface and an I2C temperature sensor 220 for sensing heating surfacetemperature. SPHCA may include a heating/charging subsystem 240 and acontrol subsystem 280. In cases where a light source, such as laser, anda P-CHIP implementation is used, alignment for the SPHCA with the lightsource may be facilitated by locating the laser at the center of acircular recess for holding the package on the SPHCA 200 and placing theP-CHIP on the center of the circular bottom of package 100, as will befurther detailed.

Heating/charging subsystem 240 may include one or more inductive heatingcoils 242 and an inductive charging coil 244. These coils may beintegrated into a single unit, or separate, and are selectivelyenergized by respective switches 248 and 249 and driven by a highvoltage driver 247 which may receive rectified high voltage power from apower supply 246. Inductive heating coils 242 may be positioned toprovide energy to the bottom and sides of a smart package 100 in orderto provide rapid cooking times, as in the case where the SPHCA may be ahot food vending machine. The heating coil is designed with Litz wirefor lower ESR of about o.131 ohms with 13 turns per layer and a Litzconfiguration of 5/40/42 for a 0.251″ wire at a pitch of 0.002″ for a6.19 uf coil. Half or full bridge drivers are used to drive the coilsconfiguration. High voltage and low voltage coils are designed forautomotive and AC based systems. The initial system is designed for 19VDC. It should be noted that this coil configuration can be adjustedwork with lower and higher voltages and also using a switched externalpower supply for added consumer safety.

Heating/charging subsystem 240 and reader 210 are controlled by controlsubsystem 280, which may include a microcontroller 282 having amicroprocessor, powered by a low voltage power supply 286. A wirelesspower controller 288 utilizes the microprocessor and a communicationscircuit to communicate to a wireless device when a wireless device is tobe charged rather than a smart package heated. A Texas Instruments Bqseries wireless power transmitter, such as bq501210 bqTESLA™ WirelessPower Transmitter or similar product may be used for the wireless powercontroller. The wireless power controller may utilize the Qi standardfor wireless charging. It may also include authentication to determinewhether or not the device is a registered product and whether or not theappliance is an approved product. As will be explained further, thecontrol subsystem 280 and microcontroller 282 may determine whether arechargeable device is present or a package is present. A “ping” may beused for to detect impedance changes and wake the system to start theidentification process for an object placed on or in the appliance. Thewireless power process starts first checking the proper impedance. Ifthis meets the proper criteria of impedance a digital ping starts toidentify the needs of the device to be charged. Then the chargingprocess begins using the Qi standard where the device provides a targetcontrol point and the transmitter delivers and adjusts as required tomeet the device demands.

According to aspects of the disclosure, power may be harvested using theRFID/NFC antenna. Using a rectifier, possibly an asynchronous rectifierand a tuned resonant frequency, energy may be harvested from the RFIDtag and stored to power a microprocessor and switch capacitor network.The microcontroller 282 includes a microprocessor and includes logic todecide when to power the I2C interface and accessory based on availablepower.

A dedicated user interface 250 may be included on the SPHCA 200 and maybe supported by microcontroller 282. User interface 250 may include avisual output device, which may be a visual status bar on the appliance200, and an audio output device, which may be a speaker for renderingsimulated human voice responses, integrated into the appliance orstandalone. User interface may also include one or more input devicesfor receiving input from a user, including a touchscreen interface,microphone and voice recognition support, which may be integrated intothe appliance or in a standalone component communicating via WAN, andone or more pointing devices or pushbuttons.

A communications circuit 284 provides communication and interfacingInternet of Things (IOT) and security/authentication, as well as othercapabilities accessed over a wide area network 10. This connection maybe utilized for appliance, package and device authentication. This addsan additional layer of safety in an attempt to eliminate counterfeitproducts, as will be explained. A number of database or web serviceservers, for example 12.1 and 12.2 may be accessed via WAN 10. Theseservers may store any number of data sets—four are shown byexample—50.1, 50.1, 50.3 and 50.4 that include package orpackage-content related information. A number of user devices, forexample, 14.1 and 14.2 may access database or web service servers andthe SPHCA 200 via WAN 10. In addition, user devices 14.1 and 14.2 maystore and execute one or more applications to enable interaction by auser with the SPHCA 200, either via the WAN 10 or via near fieldcommunication (NFC) technologies, such as Bluetooth.

According to an aspect of the disclosure, the storage 112 in the PICM106 (FIG. 1) may include a product cooking data set including parametersutilized by the control subsystem 280 to perform an optimal cookingoperation on the contents of package 100. An example product cookingdata set may include: a start at ambient temperature, a firsttemperature set point and a holding temperature, then a time required toheat a product, such as a time to pop popcorn, then temperaturecorresponding to an “off” status. The start at ambient is the firsttemperature setpoint and required/expected energy to be used. Theholding temperature is the temperature setpoint and required/expectedenergy we expect to pop the corn within the hold time. Data representingthe thermodynamic mass cooling over time based on the actual volume ofthe package and the given heat applied may be used to controloperations, and energy may be supplemented during an operation tomaximize the heating experience. Even in the off cycle the proper cooldown may be specified as a package constraint. For example, a packagedfood item may require that the contents of that package be heated to atemperature above the desired or specified temperature for consumptionduring the food preparation process. The package will continue toprovide temperature data to the consumer even after the heating processis completed indicating when the package is safe to touch or thecontents have cooled to the desired/pre-determined temperature forconsumption. The product cooking data set may also include an optimalinductive receptor temperature, to which the heating operation iscontrolled, the receptor temperature is tracked as a predetermined andmeasured offset for that package using both the PCIM temperature and thesurface temperature 220 offset by the 292 ambient sensors for receptorreferences and other parameters may be represented as parameters in thestorage 112 (FIG. 1) and may be determined in a calibration and testingsystem during a package manufacturing operation done prior to theheating operation on the appliance.

According to aspects of the disclosure, data stored in storage 112, orretrieved from a remote database server 12.1, based on a product'sunique identifier may include, without limitation, a stock-keeping unit(SKU) ID, product data (name, viscosity, specific gravity, % of liquid),package data (fill accuracy, change over time, altitude offsets, limits,base pressure), a target cooking temperature, encryption codes for anauthentication step, a used/not used status indicator, production date,production batch and lot, data defining recommended stirring intervals,a maximum package temperature, expiration date, cooking instructions, adesired heating coil frequency, amplitude, power profile overtemperatures (surface and RFID tag), ambient operating offsets, packageand receptor temperature vs. time vs. temperature appliance vs time isstored as a transform function over time). The altitude and ambienttemperature are stored as offsets to the transform function as seen inTable A. The receptor temperature is assumed based on measuringoperating characteristics and storing the offsets of the surfacetemperature and package temperature.

The above operational data may be developed during a manufacturing step,where a package may be tested and calibrated for an optimal cookingoperation a given experience. A manufacturer may use a test platform toperform a series of predetermined heating or heating related operationson a given package in order to determine the thermodynamic responsecharacteristics. Data tracked, logged and/or acquired during thisoperation may include data representing placement of the package to beheated on the appliance, in various offsets, which may be physicaloffsets at 0.1″ increments. Package response characteristics at each ofthese offsets may be determined. This data may be saved or associatedwith the particular package and stored as package offsets, temperatureand power adjustments, expected ranges of operation and variations.These offsets, adjustments and variations are suitable modifiers tooperational curves or correlated data representing package thermodynamicresponse characteristics. If a particular set of correlated data oroperational curve is sensed by the system, the placement (i.e., centeredor offset) of the package on the appliance can be determined and controlparameters adjusted accordingly. This data is recorded and stored in thetest equipment and may be reduced to more simple data curves orcorrelations (i.e., flat files with table data) for storage in the RFIDtag or storage on a server in association with a unique identifier forthe package. According to aspects of the disclosure, these operationalparameters and control curves/correlations for that package may beutilized by the control subsystem 280 (FIG. 1) to control the cookingoperation. Use of this data can thus provide a level of awareness andintelligence on the part of both the user and the appliance 200 that isimproved compared to the prior art.

FIG. 2 is a block diagram showing an example data architecture that maybe utilized by example appliances in accordance with aspects of thedisclosure. A package manufacturing data set 50.1 may include dataidentifying top sellers, average manufacturing to use time, time of dayused, user's information by product, where sold, where used, and loyaltyprogram information. A device manufacturing data set 50.2 may includedata regarding where the appliance will be used, where it was sold, usertypes, time of day, place, hours used, top 100 products used, userinformation by segment, product by segment and type, and loyalty programinformation. An end user data set 50.3 may include information relatingto a user's consumption, products used, accumulator information,favorites, nutrition information and loyalty information for the user;an end user data set 50.3 may include user consumption data, anidentification of products used or researched, accumulated values ofamounts consumed, favorite products, user nutritional information anduser loyalty data. The package manufacturing data set 50.1, devicemanufacturing data set 50.2 and end user data set 50.3 may be accessiblevia a cloud service via the WAN 10 (FIG. 1).

Still referring to FIG. 2, other data sets in an example dataarchitecture may include data from a mobile device profile 50.4 whichmay include a device ID, device location, various notifications, asensed local temperature or other environmental conditions, a timeindicating when a product is ready (i.e., cooking is complete), a readystatus indicator or flag and product interface data which relates to themobile device interaction with a given product. Mobile device profiledata 50.4 may be conveyed and received via WiFi or cellular dataconnection to the cloud services. A user profile data set 50.5 mayreside on the mobile device associated with the mobile device profile50.4. User profile data set may include a customer identifier, shippingaddress, billing information, order SKU preferences, past order SKUhistory, additional users of the device by customer identifier, favoriteSKU's list, and loyalty information. A device (appliance) data set 50.6may include a device ID, manufacturing date, product SKU usage list,accumulated usage by SKU, accumulated time of install, top 10 productSKU's accumulator, top 10 time of day SKU use accumulator,notifications. The device (appliance) data set 50.6 may be linked to themobile device profile 50.4 via a Bluetooth low energy link (BLE).

Still referring to FIG. 2, a product data set 50.7 may include a productidentifier, SKU, price information, recipe information, such as cookingtime, cooking temperature, stirring time and intervals, requested endtime, altitude, location, a target cooking temperature, target servingtemperature, an expiration or use by date, a manufacturing date, loyaltyprogram data and promotional offers data. The product data set 50.7 mayinclude data that represents one or more thermodynamic load profiles(TLP) for a given product package SKU. As will be explained, the TLP maybe used to control a heating operation and other operations related tosafety or other functions when the package interacts with a smartheating appliance.

FIG. 3 illustrates a table representing a thermodynamic load profile(TLP), in this example, also termed a heating and safety profile, foruse in controlling a smart appliance for a particular smart packageaccording to aspects of the disclosure. In this example, a TLP for amicrowave popcorn smart package is used. The data in TLP 300 may begenerated during a package test and calibration operation that may occurprior to production and shipping of a large number of packages toconsumers. Package testing and calibration may occur on a data loggingand test appliance, which has the components of the SPHCA of FIG. 1 aswell as additional sensors for environmental conditions, for example.Data in TLP may represent environmental parameters such as ambienttemperature 302 (i.e., 70 degrees F.), altitude (1222 feet) 304. It willbe understood that test or calibration data may be generated for anumber of different environmental parameters, such as for differentambient starting temperatures and different altitudes. Data may includea food or product type identifier (popcorn) 306 and a known inductiveheating coil frequency (55,660 KHz) 307.

According to aspects of the disclosure, TLP may also include parametersrepresenting thermodynamic response of the package for a number ofdifferent steps. In the example shown, data for six steps may beacquired and logged during a packaging testing and calibrationoperation. For each step, thermodynamic response data correlations areobtained and stored for later use in appliance and package heatingcontrol and safety operations. The data correlations may includecorrelations of heating coil power and duty cycle, heating surfacetemperature, package internal temperature, time and any other parametersthe correlation of which may represent a thermodynamic load or responseof the package.

The TLP may include data that represents testing and calibration inputsor “functional measurements”, represented by the data in columns (1)thru (8) in FIG. 3—Target Temperature, Time to Target, Charge SurfaceTemperature, Tag (sensor) Temperature, Voltage, Frequency, Duty Cycleand Measured Power. In addition, data representing direct measurementsmay be logged as shown in columns (9) thru (11)—Material Probe Low Temp,Material Probe High, Package Probe Temp, which may represent directtemperature measurements made on the package materials and contents.

An example process for testing/calibration and acquisition and loggingof the TLP data will now be explained. The TLP data may be developed ona packaging test and calibration system (PTACS). In Step 1, a TestSystem command function may be executed to bring the package contents toa 90 degree F. Target Temperature within a 5.5 second period. The PTACSallows packaging companies and research personnel to test and designcustom experiences. The PTACS may comprise a computer with control stepsthat records data from the package and typical transmitter ortransponder with an output as seen in FIG. 3. The experience designercan use the calibration and test system to set target temperatures andmeasure what actual temperatures the package achieves and in what timeframes. The package fill formula is logged and thermodynamics of thepackage and materials are recorded with several temperature probes aswell as the package LEM or package information system. This systemprovides for the calibration of the package sensor and various safetyoffsets for several measured points of the package. The temperaturesensor of the transmitter is also measured and when the desiredexperience is designed the data is output to a data file such asrepresented in FIG. 3. This TLP data may enables a transmitter toextrapolate measured values while processing the real time data. Thissystem calibrates the package to a variety of thermodynamic propertiesand builds a thermodynamic profile with the various offsets related tovarious temperature sensing. This enables the experience to be tracked,and detailed modeling of the package thermodynamic responsecharacteristics, which not only enable efficient control of heating butalso enable the package to be authenticated by its thermodynamicproperties as compared to the package data read by the transmitter andto assure altitude and high and low temperature operation and safetyconsiderations. A National Instruments Lab View control system may beused to read the thermocouples and communicate to the transmitter deviceto gain transmitter data and read package date remotely. This system maybe used by designers and package suppliers to properly and safelycharacterize an experience for a given package. The operation related toFIG. 3 may work in the following manner. Probes may be placed on thetarget package at the top of package (Material Probe High, column (10))and at the bottom of the package (Material Probe Low, column (9)), thesemay typically be the receptor locations and it may be desirable to seethis temperature related to the offsets and differences as testpersonnel seeks to insulate this temperature from the outside package.The receptor temperature (column (9)) is directly measured. The packageprobe data (column (11)) is data from a calibrator for the tagtemperature reading and places in close proximity to that tag sensor.The system may be connected to a test transmitter that operates at aknown the frequency 308, power (column (8)), duty cycle (column (7)) andvoltage of the rail (DC into the drivers) (column (5)) as well as thesurface temperature (column (3)) and ambient temperatures. The systemtracks the thermodynamic load for the specific package contents. Thesystem may test thermodynamic responses for minimum fill and maximumfill conditions of a package to get a statistical view of thethermodynamic package and each curve can be loaded into memory on thetag for use by the transmitter if that manufacturer want to see postfill levels. The system commands are then loaded and the test systempredefines the energy, frequency and trajectory of the experience. Thispre-characterization is important to define the experience and theoperational steps to heat properly. The frequency and power may be tunedto the material, material size and proximity of the receptor. The dutycycle may be designed to deliver the best power just off resonance,typically just below or just above resonance for better control. Thetemperature set point may actually be a combination of the receptor(column (9)) and package probe (column(11)) and top material probe withthe material to be heated also being measured. Stirring, shaking andkneading may be needed at specific points to encourage additional evenheating. The experience steps and timing are recorded as the experiencebecomes repeatable. The tag temperature (column (4)) is recorded withthe offsets for the related additional calibration probes (columns (9),(10), (11) and (3) to calculate an average temperature for this packagewith given thermodynamic load over specific times. The best trajectoryand timing is determined by the user and that experience may be loadedas the experience for that package and stored as an image for that tag.That tag is then replicated for production until that formulation orpackage changes, assuring a great experience that can be replicated andauthenticated by the appliance.

Still referring to FIG. 3, use of the TLP in controlling a heatingoperation will now be explained. In this example, which may be formaking popcorn, the process may begin by checking the package. Thesystem may determine the type of package by monitoring the measuredinductive coil power vs. inductive coil frequency over a range offrequencies, both higher and lower than a target value. The system mayalso utilize typical offsets determined in the package testing andplacement operation. Thus, this data may be a form of packageidentification, validation and determination of placement. Testfrequencies may also be used to determine placement adjustment.Frequency selection may be determined by the control system once anactual heating process starts. These initial validation steps can beused by the system to confirm that the actual package type placed in theappliance is the expected type of package. Thus, the TLP may be used ininitial operations for package validation. Once package validation (andauthentication, as will be explained) occur, the package heatingoperations may be undertaken by the system using previously determinedheating trajectories and ranges of the operation, as will be explained.

Still referring to FIG. 3, the TLP includes information that correlatessystem parameters, such as surface temperature, with different steps ina heating operation. Because the monitored parameters vary linearly, thedata points in the table representing the TLP may represent a continuouscontrol curve and the system may calculate the expected change of agiven parameter over time using the data set stored in the TLP.

According to aspects of the disclosure, each of the sensed parametersmay include an error threshold such that when sensed values, such astemperature, deviate from the prescribed curve (data correlation) by anamount that exceeds the error threshold, the system indicates a faultand the heating operation may be interrupted or terminated. Thisprovides a very safe operating system with no single point of failure.In prior art systems, this has been an issue, especially in relation toenabling unattended or remote heating/cooking.

Still referring to FIG. 3, various commands, each representing a heatingprocess or heating process related operation may be represented in theTLP. For example, step 2 represents a heat to target operation. Step 3represents a hold heat and finish heat operation. Step 4 may be a pausecook operation. Step 5 may be a hold heat operation. Step 6 may be an“off” status operation. During each of these operations, the appliancemay control the package heating while tracking power, surface, packageand time. Offsets may be adjusted for ambient temp and altitudeoffsetting the linear performance of time and temperature curves. Dutycycle or frequency may be used to offset power and tune to a betterpackage power. Tests can be made with known frequency interactions. Forexample, if the ideal for the package is 55.56 KHz, there will be adifferent reaction at 50 KHz and 60 KHz and these frequencies provideguide points for validation. A safe guideline for the starting error mayabout 7% of target for each area of monitored interest. Once the packageor end manufacturer determines the optimal heating experience steps fora given package type, using a test or calibration platform, and the datais stored in a TLP corresponding to that particular package, a heatingappliance according to aspects of the disclosure may retrieve the TLPthat corresponds to that package and may perform the same operations andaccording to the same control parameters to replicate the heatingexperience according to the initially determined test/calibration steps.

The TLP's according to aspects of the disclosure may include powerexpectation information, which may include data that correlates timewith package temperature, receptor frequency, receptor temperature,surface temperature, current, voltage and power as set forth in exampleTable A below:

TABLE A Pack- Tx age Receptor Receptor Surface Tx Volt- Time TempFrequency Temp Temp Current age Power 0 70.00 555000 70 70 2.9 27 78.30.1 72.19 555000 76.44 72.8 2.9 27 78.3 0.2 74.38 555000 82.88 75.60 2.927 78.3 0.3 76.56 555000 89.31 78.4 2.9 27 78.3 0.4 78.75 555000 95.7581.2 2.9 27 78.3 0.5 80.94 555000 102.19 84 2.9 27 78.3 0.6 83.13 555000108.63 86.8 2.9 27 78.3 0.7 85.31 555000 115.06 89.6 2.9 27 78.3 0.887.50 555000 121.50 92.4 2.9 27 78.3 0.9 89.69 555000 127.94 95.2 2.9 2778.3 1.0 91.88 555000 134.38 98 2.9 27 78.3

According to aspects of the disclosure, other data that may be stored inthe TLP may include use by (expiration) date; minimal and maximal powerprofiles with ambient offsets, ambient temperature measurement forprofile time and temperature offsets; temperature profiles; minimumliquid, maximum liquid, ideal profile, time and temp, altitude offsetsby location and heating methods. The energy required to heat the packagemay have some major modifiers for profiles. The first is a starting orambient temperature. This is a time and energy offset to the profiles asthe starting point. It may determine a new cooking time and either addsto subtracts to the energy and cook time required. Another parameter mayinclude pressure for altitude also has an offset requiring differenttemperatures for altitude. These altitude offsets may be saved as atable and when the user inputs the altitude the system may utilize theoffsets. If not, the profile will not match and the system will shut offwhen attempting to meet a package profile. These parameters are bothsafety related and operational modifiers.

FIG. 4 is an example logic flow diagram showing logic that may beperformed by the SPHCA microcontroller 282 (FIG. 1) to detect a smartpackage to be heated and to initiate a heating operation for the smartpackage. At 402, a decision is made as to whether or not a package isdetected. This may be done using the transponder or a device analog anddigital authentication ping, for example, using the wireless power Qistandard. If no package is detected at 402, the logic proceeds to acharger routine at 504, which will be described herein. If a package isdetected at 402, the logic, at step 406, causes the SPHCA reader toobtain a unique identifier as read from the microtransponder, andretrieves from appropriate databases via the WAN 10 (FIG. 1) operatingparameters, such as power requirements, product information, profileinformation, time information, power expectation information, anddetermines control type. The power expectation may be the power expectedwith a given offset as discussed earlier. The control system may match aheating curve over time based on the efficiency of power transfer. Anideal match may be determined based on the package placement andoperating curve. The system will undertake steps to find a match. If nomatch is found, the system may indicate that package cannot be validatedand that the package has been tampered with. A test stage (FIG. 3,Step 1) may be used to quickly find the starting match for the propercurve. Identifying the proper curve allows additional adjustments to beapplied as needed. If the package identified to be offset by 0.5″ ormore the system may choose to adjust the frequency and power foradditional resonant efficiency as one example.

Still referring to FIG. 4, at decision step 408, the logic determines ifa package is present and operating temperature as expected in theprofile identified in FIG. 3 and Table A. Current vs frequency is alsotracked with range limits and surface temp vs power is also checked withrange limits. At step 410, the power control system is initiated byprofile and time. In a very short time during a power-up step, thesystem can determine whether or not a given package is performingaccording to an appropriate TLP. If not, operations are halted. Thecontrol system may use all inputs and profile settings to identifypresent parameters and operation ranges over time and temp to validateagainst RFID data and expectations. At step 412, an error check is made.If an error is detected control is shut off at step 414 and an interfaceto cloud step at 428 is performed. New values to EEPROM accumulators areupdated at 426 and the logic returns to step 402. If at step 412 noerror is detected, a determination is made at 416 as to whether a targettemperature is reached. If not, the logic returns to step 410. If yes,the logic displays data and alarm at step 418 and then determines at 420if the temperature should be held. If yes, the system interfaces to thecloud at 424 and proceeds to step 410. If not, the system interfaces tothe cloud at 428 and proceeds to steps 426 and 402 as previouslydescribed.

As will be recognized, specific operating thresholds may be stored in aTLP based on materials used in packaging, product attributes and otherparameters. A packaging manufacturer may be very conservative in settinglimits for materials and profiles. Each material will have specificoperating thresholds and pretested limits that may be programmed basedon a package test system. The authentication process is required forunattended modes where the user would like to heat in the absence of auser. This is required to authenticate the package and the controlsystem thresholds from the updated control database. An additionalauthentication also occurs when the package behaves as the RFID profileindicates. If a material has an updated threshold or has been recalledwe want to identify each package configuration so we can trackperformance. When the package data is read and the unique ID is obtainedthat data is shared to the cloud along with the unique appliance ID. Thesystem provides a token for use to operate the system based on anapproved test and validation question. The updated information can beused to recall or update the operating information on the fly. Eitherthe product is disabled or it functions under the new profiles.

An example smart package configuration and process for heating a smartpackage according to aspects of the disclosure will now be explainedwith reference to FIGS. 5 and 6. An example smart package 500 forbrewing tea may include a tea tumbler having cylindrical container body502 having a container base 504 and a removable (i.e., screw-on) cap 506at an opposite end. The container 500 may include a first inductivereceptor 530.1 and first insulating spacer 540.1 positioned near thebase 504. A second inductive receptor 530.2 and second insulating spacer540.2 are positioned near the cap. A first package intelligence andcommunication module 506.1 is positioned near the base. A second packageintelligence and communication module 506.2 is associated with a teapackage 150 secured within the container 500, for example, in a teabasket associated with the cap 506. Container 500 may include a supplyof brewing liquid, i.e., water contained therein. The insulating spacermay be a material such as paper or plastic corrugated insulators such asthat used for the rings that protect a cup of hot coffee. Smart package500 may be first positioned on appliance 200 in a heating position shownin FIG. 5 in which the tea container 150 is oriented above the watersupply and appliance 200 provides energy to the receptor 530.2 to heatthe water to a brewing temperature. When the water attains a desiredbrewing temperature as sensed by a temperature sensor in PICM 106.2. thetumbler 500 may be inverted and thus oriented in a brewing position forbrewing tea. The presence of inductive receptors on each end of thecontainer enable it to be heated in a water heating orientation andflipped to assume a tea steeping/brewing orientation. A mobile device14.1 running an application for user interaction with the appliance 200may include a display 530 of relevant information to a user including atea selection (DARJEELING); brewing temperature (185 F); Steep Time (3minutes); Steep Alarm Status Setting (Notify) and Instructions(Steeping). User interface may also include displays and user inputprompts for tea selection 530.1; steeping temperature 530.2 and steepingtime 530.3.

According to aspects of the disclosure, a data set representing adesired steeping temperature for the water may be retrieved based on auser interaction with a mobile device 14.1 that interfaces withappliance 200. The data set may include information representing brewingtemperatures and times for different types of tea, for example, asrepresented in TABLE B below:

TABLE B Brewing Time Tea Type Water Temp (F.) (min) White 175-185 1-3Green 180-185 3 Black 206 3-5 Darjeeling 185 3

Referring additionally to FIG. 6, a method of operating a smartappliance 200 according to an aspect of the disclosure for brewing teain the smart package, such as the tea tumbler, described above isfurther detailed. At step 602, a user may insert a smart tea packageinto a basket in the container cap, fill the container with a suitableamount of water and place the container on the heating appliance 200 inthe heating orientation shown in FIG. 5 in order to apply inductiveheating energy to the water. At step 603, an authentication step mayoccur for the tea package, container and even the appliance, accordingto systems and methods that will be described. At step 604, the smartappliance reader 210 (FIG. 1) may receive identifying information forthe tea package. In addition, identifying information for the brewingcontainer may also be received from the PCIM 506.2 (FIG. 1). Theidentifying information may include a unique serial number for the teapacket and for the container. This identifying information may be usedto retrieve additional information, such as brewing times andtemperatures, to automatically control the brewing operation. At 606, auser device, which may be in communication with the heating appliance200, may display the type of tea being brewed and prompt the user for aselection of the tea type. At 608, information about the type of teaselected is received by the appliance 200. At 610, one or more data setsare retrieved for the brewing operation, based on the tea packageinformation, container information and input by the user. The retrieveddata set may include ideal brewing temperature and time for the type oftea selected. At 612, the heating appliance 200 may set operationalparameters based on the retrieved data sets, including temperaturethresholds, rate of energy applied to the container, thresholds fordetection of foreign objects or faulty packaging and others as describedabove. At 614, the water is heated to the desired brewing temperature bythe heating appliance 200 under control of the control subsystem 280(FIG. 1). The ideal water temperature may be retrieved from a database,based on the unique identifier associated with the tea packet. Thetemperature of the water may be monitored by a temperature sensorassociated with PICM 506.2 and conveyed to the heating appliance 200.Information may be displayed real-time to the user on a user device oron the user interface 250 (FIG. 1) of the appliance 200. At 616, afterthe desired brewing temperature is attained, the user is prompted viathe user interface to flip or invert the tumbler to a brewingorientation. Water in the container then surrounds the PCIM 506.1 andmay continue to be heated or maintained at a desired temperature usinginductive receptor 130.1. At 618, a desired brewing time is displayed tothe user to indicate the time remaining for brewing. At 620, after thedesired brewing time has passed, the user is alerted that brewing iscomplete and prompted to flip the tumbler back to the heating position.At 622, the user may be prompted for a desired drinking temperature andthe data entered by the user corresponding to the selection is conveyedto the appliance 200. At 624, the appliance maintains the desireddrinking temperature until the user consumes the tea.

FIG. 7 is an illustration of an example package configuration in whichthe package may be cup-shaped package 700 with a sealed lid 702 andwherein a PICM 106 with a temperature sensor is disposed in a locationwithin the package 700 for permitting reading by an information reader754 on a smart appliance 750 and disposed for reading from the side ofthe package 700. A charging coil 752 may be located on the appliance 750for wirelessly charging chargeable objects that may be placed thereon.An inductive receptor 730 may be supported on a insulating spacer 740,which also maintains the receptor 730 in a position in which it is freefrom direct contact with the package walls and may be surrounded byliquid or other components of the contents that provide insulating andheat transfer capabilities.

FIG. 8 is an illustration of an example package configuration in whichthe package may be cup-shaped package with a sealed lid and wherein aPICM 106 is disposed in a location within the package for permittingreading by an information reader disposed beneath the package. Thepackage may be cup-shaped package 800 with a sealed lid 802 and whereina PICM 106 with a temperature sensor is disposed in a location withinthe package 800 for permitting reading by an information reader 860 on asmart appliance 850 and disposed for reading from the bottom the package800. A charging coil and information reader may be integrated into asingle unit 860 for heating and for wirelessly charging chargeableobjects that may be placed thereon. An inductive receptor 830 may besupported on an insulating spacer 840, which also maintains the receptor830 in a position in which it is free from direct contact with thepackage walls and may be surrounded by liquid or other components of thecontents that provide insulating and heat transfer capabilities.

FIG. 9 illustrates an example of a highly resonant smart package 900 andinductive heating coil configuration that may allow extra heatingdistance between the inductive coil and receptor. A first inductive coilL1, which may be driven by a driver 950 may induce a second inductivecircuit L2, which may induce, through a countertop 952, second inductivecoil L3 located within the package 900. Package 900 may function as afourth inductor L4 and may be tuned in its configuration, such as thematerials used and the location and shape of inductive components,including inductive receptor 930, such that inductive heating ismaximized and may occur across relatively longer distances thanattainable in the prior art. The package coil 960 may be a commerciallyavailable stamped conductive coil such as those sold by The A.K.Stamping Company of Mountainside, N.J., USA. This configuration maypermit a heating appliance to be disposed beneath a countertop (i.e.,granite) having substantial thickness.

FIG. 10 is an illustration of another example of a highly resonant smartpackage 1000 and inductive heating coil configuration that allows extraheating distance between the inductive coil and receptor, where thepackage may have a receptor 1060 located in the center of the package.Because the inductive coil may transfer energy across a relatively longdistance, the package may be configured with an inductive receptor 1060disposed in a location that is vertically displaced from the packagebottom. This may provide more even heating of package contents. The PICM106 may be disposed on the bottom or side of the package.

FIG. 11 is an illustration of another example package configuration,including a sealed, heated package 1100, a PICM 106, which may include alight-energized microtransponder 110 and a temperature sensor 120. Aninductive receptor 1130 and an insulating spacer 1140 are disposed in abottom location within the package. The spacer 140 allows fluids withinthe package to operate as a simple insulator for the receptor andprevents the inductive receptor 1130 from heating package materialsexcessively or directly. It should be noted that the heating materialmay be corrugated or have facets or support legs that limit the thermalcontact to the outer packaging or insulating material.

FIG. 12 illustrates an example package configuration with a shieldednear field communication (NFC) tag that allows both heating and readingthe tag. The package 1200 may include a metal can 1202 or othercontainer having metallized surfaces. The NFC tag 1204 may include aharvesting coil such as an RFID tag or a LEM. A temperature sensor 1206may also be provided. Near field communication tag maybe located nearthe bottom of the package. In the case of a P-chip or LEM, the elementmay be attached to an outer surface 1210 of the metal can 1202 alongwith the temperature sensor 1206.

FIG. 13 is an illustration of an example package configuration 1300 thatmay comprise a metal can 1302 and a side mounted NFC tag 1304 that maybe provided as a label or other element that may wrap all the way arounda metal can 1302 included as part of the package. As will be understood,the NFC tag coil maybe printed on a package label during a printingoperation. In the case of an LEM, the LEM may be attached to the labelwith adhesive or embedded therein during a printing or manufacturingoperation. A temperature sensor 1306 may be included.

FIG. 14 illustrates an example smart vessel 1400 such as a coffee cup,baby bottle or bowl that may have a receptor 1430, smart sensor 1404 andtemperature sensor 1406 built into the vessel, such as by moldingtherein. The vessel maybe a cup, bowl, baby bottle or other cooking orheating vessel. The receptor 1430 may be a discrete component or may bea layer of silver thin-film or a foil laminate on the vessel 1400.

FIG. 15 is an illustration of another package configuration in the formof a reusable insulating an heating sleeve 1502 which may be providedwith PCIM 106, including an information chip 1504 and temperature sensor1506. The sleeve may include an inductive element, such as a metallic orfoil element to provide heat. Alternatively, the lower area of the cup1510 may include an outer wrap that may have inductive heatingcapabilities. The insulating outer sleeve serves is a grip and as anouter surface for the portable heating sleeve.

FIG. 16 is an illustration of smart, standalone inductive receptor 1600that may be in the form of a puck that maybe utilized in any type ofpackage for smart heating operations. The puck may include an inductivereceptor 1630, PICM 106 with information chip 1604 and temperaturesensor 1606 all sealed inside of the puck to avoid contamination orcontact with the heated product. Receptor 1630 may be located near outersurfaces of the puck to improve heat transfer to the surrounding liquidor product. The puck maybe inserted directly into liquid contained in apackage to be heated. The puck may have an annular construction or anyconfiguration that maximizes surface exposure to the liquid contained inthe package. The receptor may include silicone to seal and bondcomponents together in a sealed package including the NFC tag andtemperature sensor and other electronics.

FIG. 17 illustrates a further adaptation of the standalone puck of FIG.16. The puck 1700 may include a clip 1760 to suspend the puck 1700 fromthe side of the container at an appropriate location within the liquidor product contained therein. Clip 1760 and puck 1700 may be integrallymolded from a food grade, high temperature resistant material, such assilicone.

FIG. 18 is an illustration of a smart package configuration including adrop-in portable receptor 1810 that may be used to heat severaldifferent sections of a compartmentalized or Bento box 1800. The drop-inportable receptor 1810 may include an LEM or NFC tag and temperaturesensor molded therein and may be made of a food grade high temperaturematerial such as silicone and may be used for selectable heating ofdifferent compartments on the box. The receptor 1810 maybe a standalonereceptor that maybe inserted into different sections of the box to heatdifferent food portions differently.

FIG. 19 is an illustration of another smart package configurationincluding a compartmentalized or Bento box 1900. In this example, one ormore compartments can be heated as desired. The receptor 1930 and PICM106 may be adhered to the bottom of the box in one or more compartments.Alternatively, separate receptors 1930 may be used in each section.

FIG. 20 is an illustration of an example smart package configuration inthe form of a smart popcorn package 2000. The package 2000 may comprisea cup container or bucket container 2002 made of a paper material. Thecup 2002 may be provided with a foil peel off sealed lid 2020 as well asa secondary sealed peel off adhesive vent layer 2030, both of whichincluded tab for permitting and user grip them. The cup may include afoil heating container 2010 disposed at the bottom of the cup 2002 forcontaining oil and/or butter as well as popcorn kernels. The PICM 106may be disposed on the interior of the container and may include atemperature sensor to support smart heating of the container and controland monitoring of the heating operation as the popcorn is prepared.

FIG. 21 is an exploded view of internal components and ingredients thatmay be included in the smart popcorn package configuration of FIG. 20.These may include a top layer of popcorn kernels 2110 in a butter or oilemulsion or paste, which is disposed above or inside a foil retainingand heating cup 2120, which is disposed above or in a thermal insulatoror conductor layer 2130. It should be noted that the heating materialmay be corrugated or have facets or support legs that limit the thermalcontact to the outer packaging or insulating material. shown in FIG. 21,these layers may be provided in a folded popcorn bag 2150 or in apersonalized cup or bucket container 2100, each of which is providedwith PICM for facilitating a smart heating operation of the package.

FIG. 22 shows further details of the smart tumbler 2200 described aboverelative to FIG. 5 and FIG. 6. This may be a smart coffee/tea maker withtwo smart heated ends with a custom tea/coffee package 2210 equippedwith a PICM. This figure shows a package strainer 2210 for loose-leaftea or ground coffee, and a tea/coffee package for premade coffee/tea.The mobile device may communicate with the smart package appliance andmay set the parameters for heating based on pre-determined parametersand/or user preference. In the case of using an NFC tag and temperaturesensor enabled coffee/tea package, the package will automaticallycommunicate with and engage the smart package appliance and mobiledevice to initiate and control specific heating parameters. The mobiledevice 2270 includes controls that indicate to the user when it is timeto turn the device upside down to remove the coffee or tea from theheated water, and the other heated end of the bottle will maintain thedesired, user specified temperature while they consume the contents.Data 2220 may be utilized in the heating operation to automaticallyselect preparation and heating parameters based on a selected product.

FIG. 23 illustrates another appliance configuration that may simulate acandle for heating scented waxes and aromatic products. In this case,the smart package 2300 may be in the form of a circular or disk-shapedfoil scent packet or wax melt package having an annular shape with acentral hole 2301 for receiving a visual effect 2372 projecting from theappliance. The contents may be sealed with a peel off top 2303. A PICMmay include an information tag, such as a P-chip, and temperature sensor2305 within the package 2300, as well as an inductive receptor 2302.Appliance 2350 may include a package receiving recess or pocket 2352shaped to receive the form of package 2300. A tag reader 2354, which maybe a P-chip reader, and temperature sensor 2356 may be disposed near thepocket 2352 to read the package tag and sense the temperature of theappliance. An insulating spacer 2368 and inductive coil 2369 may becontrolled with components similar to those in FIG. 1. Multicolor LEDlighting 2370 may be included for visual effect and a translucent outerpackage casing 2376 enables viewing of the internal lighting effects.Light pipes 2372 may convey the light from LED lighting 2370 to theouter package casing 2376. A mobile device 2380 may be configured to usefor control and reordering of product. An application may interface withthe control components on the appliance 2350 and may provide a visualdisplay 2382 indicating a particular room (Living Room), an appliancestatus (LightScent ON); a type of scent (Pine Forest); a heatingtemperature (145 F); an interval parameter; a scent level indicator; alighting scheme indicator (flickering candles); an intensity level(50%); a limit for automatic reordering (20%); and an error field forindicating errors (i.e., Remove Lid/Tab).

FIG. 24 illustrates additional appliance configurations 2400 and 2450according to an aspect of the disclosure. In these configurations, thewax melt packages 2470 and 2472 may be made without a discrete inductivereceptor and instead metallic components on the package may function toinductively heat the contents. Although not illustrated in this Figure,NFC tags and temperature sensors may be included in the packages and incommunication with the appliance reader for increased control of heatingand safety operations. The packages may be made of paper or plasticcomponents and a metalized liner or foil added to the package structureto function as an inductive receptor. Appliance 2400 is configured toreceive and heat a single package. Appliance 2450 is configured with anadapter 2452 to receive multiple packages 2460 and 2462 in respectiverecesses in the adapter. Adapter 2452 may include aesthetic features tosimulate the appearance of a candle or other item. As will berecognized, with the package configuration 2450, adapter may includeinductive heating receptors for each package to save costs such that thewax melt packages 2460 and 1262 can be made from low cost materials thatdo not necessarily have to function as inductive heating components. Aswill also be recognized, each of the multiple packages can include aPICM for separate interaction with an information reader and controlelements on the smart package appliance 2450 as described above relativeto FIG. 1. The mobile device can be used for control and reordering.

According to an aspect of the disclosure, wax containing packages mayinclude waxes with a higher melting point than attainable in the priorart. Controlling the level of heating directed at the Smart Meltpackage, where it receives more heat to start the initial melt and thenreduces the heat to maintain the liquid state, may allow for the use ofa higher melt point wax and eliminate the need for temperaturecontrolled shipping while maintaining safe operation through the entireheating cycle.

FIG. 25 illustrates different package configurations that may beutilized with an appliance that has three spots for heating multipleproducts. These package configurations may include an oil diffuserpackage 2502, a first heatable scent package 2504, a second heatablescent package 2506 and a heated vessel 2508, such as a novelty gift orcoffee cup. It will be understood that one or more tag readers may bedisposed in a base in an appliance 2550 and may interact with PICMelements (not shown) on each of the package configurations.

FIG. 26 shows an example smart device 2600 with a mobile application andinterface including a display 2650 for permitting a user to interfacewith appliance 2550 and smart packages being used with the appliance2550. The user interface may include controls for scheduling product andtimes of use 2610, indicators for remaining useful life 2620 and acontrol for selecting one or more bases 2630 to control. The applicationand smart device may provide for controlling times for heating differentproducts or packages, and the ability to select from multiple smartpackaging appliances to control.

FIG. 27 illustrates a P-chip or LEM equipped package 2702 as well asexample information exchange configurations according to aspects of thedisclosure. Appliance 2750 may include a circular recess 2752 whichreceives a circular cup 2702 or other circular container. A P-chiptransponder 2704 may be located centrally within the base of the cup2702. A light source, such as a laser may be located in the appliance2750 and positioned to deliver light to the centrally located P-chip topower it. Data may be read from the transponder to identify the product,packaging and other relevant information. The P-chip may thus conveyinformation to the appliance 2750, which in turn may convey informationto a mobile device 2760 via wireless link 2762. The package mayalternatively or in addition be provided with a 2-dimensional code 2708which may be read by a camera on the mobile device 2760 in order toidentify the unique ID of the product which may be stored in a clouddatabase and retrieved. Mobile device 2760 may retrieve information fromand send information to a remote server 2770. This information exchangeconfiguration may provide just-in-time registration services forproducts and users. The mobile device application may transmit a userprofile and product information to the cloud. Usage information may alsobe transmitted to the cloud. User preferences may also be transmitted tothe cloud. Required information may be shared back to the applicationand to the appliance 2750. Identification and validation of packages mayalso be provided using this information exchange configuration, as willbe explained. Cloud based customer relationship management (CRM) systemsmay send loyalty information to users and may convey order or re-orderinformation.

FIG. 28 illustrates a top and side view of an example coatedturbine-like metal stamping inductive receptor 2802 that may be usedwith package configurations according to aspects of the disclosure. Thestamping may function as an inductive receptor itself. The stamping mayfurther include an inductive base disk portion 2804. The stamping may beprovided with one or more slots that may impart rotational motion to theheated fluid as it rises through the stamping to facilitate improvedmixing and heat distribution. The inductive receptor 2802 may bestationary or may be mounted for rotational movement on a central pivotor raised portion of the bottom of the package, such as the apex of acone-shaped package bottom wall. A lower fluid movement space 2812 maybe defined between the receptor 2802 and the container bottom wall 2810.The receptor outer diameter may be chosen to define an annularinsulation and/or fluid movement space 2814 between the outer diameterof the disk-shaped receptor and the diameter of the package container inwhich the receptor is located.

FIG. 29 illustrates top and side views of another configuration for aninductive receptor that may be used in packaging configurationsaccording to aspects of the disclosure. The receptor 2902 may have ageneral disk shape with an inner tube or chimney portion 2904 fordirecting liquid/fluid upwards or causing conductive and convective heattransfer within the fluid/liquid. Features, such as protrusions or finsmay be disposed and control/direct flow or to create turbulence withinthe tube or chimney portion 2904. An outer annular passage or insulatingspace 2914 may be defined between the outer diameter of the disk-shapedreceptor and the package container wall. A bottom insulating space 2912may be defined between the lower surface of the receptor and thecontainer bottom wall.

FIG. 30 is an illustration of an example smart package 3000 with tunedmaterials that allows the NFC tag 106 to be read from the bottom sideand the receptor to be heated from the bottom with a lower frequencyinductive source while masking these same materials from microwaves fromabove. The NFC tag is on the bottom so that the reader may be locatedin, for example, a carousel that supports the package. The tag isshielded from the conductive materials so that the NFC tag can be read.A cured and coated silver ink may be used.

FIG. 31 shows an example package in the form of a metallic can or vesselthat may be utilized with an appliance with multiple heating coils or asingle coil that may cover a large percentage of the body of the can orvessel. Because the physics of dissipation are greater over more surfacearea a faster heating can be achieved utilizing a higher surface areawith lower overall surface temperatures.

FIG. 32 is an illustration of a package that includes a two-partassembly which defines an internal air or vacuum gap 3204 for insulatinga cooking surface 3252. This structure may be advantageous in protectinga user and appliance from the heat of the inductive receptor at thecenter of the package. This may allow higher temperature materials incooking to be used without the same exposure to the appliance and user.Such materials may include PYREX®, glass, paper, plastic, PTFE, PET orother materials. An outer container 3202 may include an outer surfaceand a sealing edge or lip or interlocking ridge 3208 that cooperateswith a like component on an inner container 3250 which fits within theouter container 3202. A metal insert 3260 or metallized surface on theinner container 3250 operates as an inductive receptor and may occupythe air or vacuum gap 3204 when the package is assembled. It should benoted that the heating material may be corrugated or have facets thatlimit the contact to the outer packaging material and may be thermallyconnected and conducting to the inner surface with heat conductinggrease etc. The cooking surface 3252 may be insulated from directcontact with the metal insert 3260 with air or a space in the gap 3204.The metallized surface can be silver ink, foil or a tin plate in theform of a sticker or plate. The plate may also be internal to the innersurface providing even better thermal conduction to the internalproduct, fluid or food. The liner or gap can also be an insulatingmaterial like fiberglass, foams or fibers that are resistant to theheat. Levels of resistance are often used as the control limits for theupper levels.

According to aspects of the disclosure, packaging may include an airspace for thermal insulation to permit higher temperature of contentsand heating elements without safety risks associated with consumerhandling of the package. Corrugated cardboard or higher temperatureresistant materials may be used on the interior of the package toinsulate outer package surfaces from the heating element and contents.

FIG. 33 illustrates an assembled and exploded view of a package 3300that includes a heating cap that may be removably attached to a bottle3302 by a threaded or other fastening means such as a snap fit. Thebottle cap 3304 may include a P-chip 3310 or NFC tag on a bottom portionthereof. An inductive receptor 3320 may be of a generally circular diskshape with inward projecting tabs 3322 that permit insertion on andsecuring to a post or stake 3312 that projects from the bottle cap andmay be integrally formed therein. The post 3312 may be of a star-shapein cross section to fit complementarily with the inductive receptor3320. An appliance 3370 may include a package reader for reading theembedded P-chip or NFC tag and an inductive coil for heating thepackage. A liner or seal 3322 may be included in the cap for sealingengagement with an end of the bottle 3302.

FIG. 34 illustrates an exploded view of an alternative package 3400 thatincludes a screw or snap on heating cap 3404 with an embedded NFC or LEM3410. A heating cup 3430 may be secured to a post or stake 3412projecting from the cap bottom.

FIG. 35 illustrates an exploded view of an alternative package 3500 thatincludes a P-chip 3510 located in a central location on a heating bottleor jar cap 3504. A package reader in an appliance includes a lightsource for powering the package P-chip 3510 and potentially othercomponents, such as sensors contained within the bottle cap 3504. TheP-chip may generate a modulated data signal 3520 in response toenergization by the package reader light source, which may be a laser.The package chip or P-chip 3510 may be attached to the bottle cap 3504using a melt process or using adhesive. In order to provide for lightenergization and line-of-sight, an over label may be provided on the capand may include a transparent, translucent or clear area, or a cutout orrecess to enable energization of the P-chip or LEM with the lightsource. The appliance base may include a recess for receiving the bottlecap to ensure alignment of the P-chip 3510 with the reader light source.

FIG. 36 illustrates a smart package and appliance with a decorativelighting feature. The smart package 3670 may be a wax melt or aromaticpackage as described above. A decorative package holder 3620 may beincluded with the appliance 3650. An inductively powered LED light 3630may be included in the package, which may have an opaque coating withlight pass thru areas 3622 for creating a decorative effect. Theappliance 3650 may include a reader and an inductive charger/heatingelement 3658. The appliance 3650 may also include a touch screen control3652 for permitting a user to adjust settings such as temperature orlighting effects. The touch screen control may include a display of acurrent setting and a di splay of adjustment controls 3654.

FIG. 37 illustrates further details of a tea/coffee tumbler as describedabove with reference to FIGS. 5 and 6.

FIG. 38 illustrates an inductively heated vessel 3800 with a coffee pourover kit 3820. The heated vessel may be provided with a PICM 106including a temperature sensor, inductive receptor and insulatingspacer. A smart package appliance 3850 may provide smart heating.

FIG. 39 illustrates an example package configuration in the form of aself-contained inductively heated coffee pour over kit 3900, which mayinclude a stainless steel inductive vessel 3902, a lid 3904 and amicro-filter screen 3906 as well as a PICM 106 for smart heating of thekit 3900 by an appliance 3950. A standard vessel (i.e., non heating) maybe used with the kit 3920.

FIG. 40 illustrates an example package configuration in the form of acontainer 4000 having a conductive internal vessel 4010 that isinsulated from an outer shell 4020 by an air void 4030. The outer shell4020 may be made of a non-conductive material. A PICM 106 may beprovided in contact with the internal vessel 4010.

FIG. 41 illustrates a package configuration for steaming food products.The package 4100 may include an offset metal insert for betterthermodynamics in a package that maintains a liquid space. The insertmay be a stamped element with tabs projecting from the sides forsupporting the insert in a position above a bottom panel or surface of apackage bottom and above a receptor 4130 and insulating spacer 4140. Theinsert supports (feet) have limited contact with the food and aresubmerged in the liquid, which limits and stabilizes the thermalcharacteristics and exposure of the package. The insert functions as aheat source when inductively energized and it remains in contact with orsubmerged in liquid during a heating operation. Moreover, the insert isfor the most part isolated from and not in thermal contact with thepackaging materials, which prevents overheating of the package materialsduring a heating operation. A vented lid 4040 may also serve as ameasuring cup for user addition of water.

FIG. 42 illustrates an inductive popcorn popper 4200 having an invertedglass or plastic jar with a threaded neck 4202. An aluminum popcornkernel cup 4210 may be provided in a threaded cap 4220 and configured toprovide an air gap 4230 between the cap and cup 4210. The cup 4210 andmay be provided with a PICM 106 for smart heating of the cup.

FIG. 43 schematically illustrates components of a light-poweredmicrotransponder suitable for use with packaging described herein. LaserLED light 4301 may be transmitted from a reader to the photo poweredarray 4302 which communicates with memory 4304. An RF transmitter 4306may send signals to the reader based on information stored in the memory2020. Transmission of signals may also be by infrared in line-of-sightapplications, as illustrated in the lower figure in FIG. 21 were aninfrared light 4350 may energize photo power and clock component 4352which communicates with memory 4354. An infrared transmitter 4356 sendsencoded infrared data signals to infrared decoder 4358.

FIG. 44 illustrates components of a photo- or light-poweredmicrotransponder 2000 suitable for supporting a PICM according toaspects of the disclosure. A light powered array 2002 creates power fromreceived light. A regulation and power supply 2008 may include storagefor electrical energy generated by the light powered array 2002 as wellas voltage regulation to power other components. A modulated light clocksource 2010 may provide a clocking signal to a divided clock-basedaddressing loop 2012, which also receives power from the regulation andpower supply 2008. Addressing loop 210 provides a signal to an outputdriver 2006 which drives an infrared or radio frequency output arrayantenna to communicate information to a reader. A storage 2020 includeslayers of addressable memory that may store data including acryptographic identifier, temperature and power information and otherinformation.

According to an aspect of the disclosure, example appliances may provideauthentication, validation and safety operations on packaging based onthe interaction between the appliance and the packaging. Validationrefers to ensuring the integrity of a package and its contents, andsafety related characteristics, for example, ensuring that no tamperingor manufacturing defects are present with regard to a product or productpackage. Authentication of a package refers to an operation of ensuringthat a package is an authentic product that has originated from atrusted source rather than a counterfeit product or that a product maybe used with a given appliance. Authentication and validation mayinvolve the use of encrypted information to ensure date integrity andmitigate safety risks. Safety operations may include ensuring thatpackage or product temperature thresholds are not exceeded duringcooking operations or during consumption or handling.

FIG. 45 is a schematic diagram showing the interaction between examplesystem components to achieve validation, authentication and safety. Asexplained above, with reference to FIG. 1, a package 100 may have aunique identification information stored in PCIM 106, which may includea P-chip, i.e., light powered microtransponder or RFID tag forcommunicating the unique identifier and other information to theappliance 200. Appliance 200 may include information regarding theappliance manufacturer, a preprogrammed validation code, an applianceunique identifier, and an encryption algorithm for encrypting data. Asmartphone or other mobile device may have an application and interfacethat may also utilize a unique identifier identifying the device and/oruser. These unique identifiers may be utilized along with cryptographicalgorithm to send encrypted test authentication requests via the cloudto a validation database 1400. The appliance control system may utilizethe unique identifiers or a portion thereof to request and receiveapproval tokens from the validation database 1400. If a positiveresponse is returned from the validation database, the appliance canconfirm that a valid package is present. The key element is thecertified database that mirrors the unique identifiers. The appliancemake implement package validation and authentication via suitablefunction calls under an operating system governing operation of themicrocontroller. For example, a function call to an encryption algorithmmay include a package encryption code and a heating appliance (cookingdevice) encryption code. Logic statements in the algorithm can thenincorporate the function call results (i.e., if valid_phone then; ifvalid_package then) to condition operations based on packageauthentication and validity. Validation processes may also provide thatonly predetermined packages may be used with a given appliance. Thisvalidation scheme assures that only approved packaging is used withapproved appliances and thereby increases safety.

According to an aspect of the disclosure, package validation processesmay utilize TLP data, such as that of FIG. 3 or in Table A above tovalidate package integrity and safety. As discussed above, the profileused in table A may be generated in advance by a calibrated test systemused by a package developer, manufacturer or packaging provider.Materials may be tested and resulting parameters may be stored in thedatabase along with measured field data to determine the allowablevariations within the field. Safety thresholds may be saved based ontesting and flash point data along with safety margins for each materialused. The larger database of test and calibration information isdesigned to allow the material thresholds to be modified based on fielddata for safety and operational performance tracking. Having multipledata points like surface temperature, package temperature and power maysupport tracking of foreign objects and user induced failures in thefield. This data can then be used to revise thresholds and allow unsafeconditions to be recognized even more accurately for enhanced safety.This same validation and authentication method may be used for packageexpiration dates and other information.

FIG. 46 shows an example security solution and chain of communicationapplicable to validation and authentication data, includinganti-counterfeiting and security, as well as example hardware to supportan Internet-of-things (IOT) supported security solution. Securitychallenges and responses may be implemented between each component inthe chain of communication including the package 100, appliance 200,smart device 14.1 and the cloud or WAN 10. The smart device 14.1 mayinclude a crypt-specification implementation wherein a microprocessor1502, which may be a component of the microcontroller 282 in FIG. 1, inaddition to supporting an appliance interface and sensors 1510 mayelectronically communicate with a secure boot-loader flash memorytransceiver 1504 and an IOT security and crypto chip 1506 to implementcrypto security. Authentication may be based on devices proving theiridentities to each other. Each device may include a unique deviceidentity (UID) which may be a 48-bit number. the authentication proof isbased on the demonstration of the knowledge of a secret code associatedwith the UID. Cryptographic techniques are used to keep that informationsecret but verifiable within the code. The AKB based authenticationprotocol uses techniques called broadcast encryption utilizing a trustedmanagement source of the keys. This provides package suppliers anddevices suppliers inclusion or exclusion of products. The encryption maybe updated or changed on a based on being hacked or on timely updates byupdating appliance firmware. Devices and packages combine the UID andAKB and secret keys to provide two shared secret keys. The devicesverify the shared keys using the network challenge/response protocol.The AKB encoding includes Version, Type of AKB, EAK List Start—the bytenumber in the AKB from where the first encrypted AK is stored, AKVerification Data—the 128-bit value 0x3212445F AF345622BF 44xxxxxxxxxxxxxx encrypted with the Authentication Key encoded in the AKB. TagData Stream tags defining the tree stored and the EAK List containingthe authentication keys contained in the AKB tree. The uniqueidentifiers coded within the chip or encrypted within the code of themicroprocessor are used to generate the test question and an TRUE orFALSE response is used to validate the authentication. DeriveKey showsthe crypto authentication process using the unique key and the targetkey reference for a TRUE/FALSE response.

The smart device 14.1 and other devices, including the appliance 200 andpackage 100 may utilize Media Access Controller (MAC) addresses for eachinterface to the network. These may be utilized in validation withfunction calls, such as the illustrated key derivation call “DeriveKey”,which may derive one or more secret keys from a secret value such as amaster key, a password, or a passphrase. A CheckMAC function call may beused to validate an encrypted MAC address. Still referring to FIG. 15,an Atmel AT88SA102S chip may be used for crypto generation and uniqueappliance identifier. The smart appliance uses this device as the uniqueidentifier and generates the challenge request encrypted for response.

FIG. 47 is an example logic flow for validation and authentication by anexample appliance. According to aspects of the disclosure, an exampleprocess for identifying the package and validating the package mayutilize the package chip, the package and potentially factory settingsof an appliance and/or package for authentication. An example processmay begin at step 1602 where a package is detected as present, an NFCtag is read and a timer is started. At step 1604, the system checks tosee if the package has been heated before, for example, if a stirringoperation was performed on a heated package. If the package is detectedas having been returned, the process may determine at step 1606 if areprocessing step is needed. If so, at 1608 a determination is made asto whether a hold temperature has been specified. If so, the process atstep 1612 calculates a hold curve and sets a hold temperature flag thenproceeds to step 1618. If at step 1606 a determination is made that noreprocessing is needed, at step 1610 the system recalculates a processtime and resets a process timer, then proceeds to step 1618 where thePICM is read and the power is adjusted and power data is logged.

If at step 1604 a determination is made that the package is not areturned package, the system proceeds to step 1614 where a cryptographicchallenge is undertaken. If the package fails this test, an invalidpackage indicator is expressed to the user through a user interface atstep 1640. If at step 1614 the cryptographic challenge is passed, theprocess may proceed to an expiration date check at 1616 where expirationdata related to the package is compared to a current date. If thepackage fails this test, an expired package indicator is expressedthrough the user interface at step 1642. If at step 1616 the packagepasses the expiration date test, then a heating operation is initiatedat step 1618 where the PICM is read and the heating power requirementsare determined. At step 1620, as a heating operation is initiated, thesystem check the actual monitored power and time against the calibrateddata stored in a TLP for the package, as described above. If at step1620 the package power vs. time correlation is different than what isstored within the TLP, allowing for variances for offsets, for example,the process goes to step 1644 to indicate that the package has beentampered with or otherwise lacks an expected integrity. This indicationmay be through the user interface. If at step 1620, the package powervs. time correlation is acceptable compared to the TLP data, the processgoes to step 1622 where a temperature vs. time data is monitored. Ifthis data does not comply with the temperature vs. time data representedin the TLP, the process goes to step 1646 to indicate package tamperingor lacking structural integrity.

If at step 1622 the package temperature vs. time actual data match theTLP, within expected variances, a heating operational sequence isexecuted. At step 1624 the heating time is updated and at step 1626 ahold temperature determination is made. The UI/UX for operatingparameters and is seen as 1626 holding temperature or exit, 1628 in thepackage not being removed and in 1630 looking for temp adjustments andcommands cycling back to the reading of the package temperature 1618.The update UI/UX for completed or stopping is seen in 1648 and the UI/UXupdate for removing the package is seen in 1650 the logged informationis used to set the flag for 1612 when the package is returned. 1652indicates either an error mode like temperature cannot be reached or theexit mode as in the end of the process and updates the UI/UX.

Although the present invention has been shown and described in detailthe same is to be taken by way of example only and not by way oflimitation. Numerous changes can be made to the embodiments shownwithout departing from the scope of the invention. The present inventionmay be further modified within the spirit and scope of this disclosure.The application is, therefore, intended to cover any variations, uses,or adaptations of the invention using its general principles. Further,this application is intended to cover such departures from the presentdisclosure as come within known or customary practice in the art towhich this invention pertains.

The invention claimed is:
 1. A smart package for use with a smartappliance for intelligently controlling heating of the smart package,the smart package comprising: a container for containing knownthermodynamic contents to be heated; a package intelligence andcommunication module for storing and communicating package relatedpre-measured thermodynamics and package content related data, thepackage intelligence and communication module including: (a) a storagefor storing an identifier unique to the package; and (b) a transponderfor communicating the identifier to a reader on the smart appliance; thepackage and package content related data including a thermodynamic loadprofile representing the thermodynamic response of the package andcontents to heating energy; a temperature sensor for sensing thetemperature of the product during a heating operation; and wherein thepackage includes a smart heating puck with an inductive receptor andwherein the package intelligence and communication module andtemperature sensor are disposed on the heating puck.
 2. The smartpackage of claim 1, wherein the thermodynamic load profile includes datacorrelating an expected internal temperature with power transmitted froma smart appliance.
 3. The smart package of claim 1, wherein the heatinginductive receptor is configured to insulate the package from directheating allowing the insulator properties to shield the consumer fromexcess heat.
 4. The smart package of claim 1 wherein the packageinformation has been calibrated and measured and the thermodynamicperformance information is included electronically on the package. 5.The smart package of claim 1 wherein the inductive receptor is insulatedby limiting contact with the package using a portion of the contact areaand points of contact or insulated with an insulating material.
 6. Thesmart package of claim 1, wherein the package intelligence andcommunication module comprises a light-powered microtransponder locatedon an exterior surface of the package.
 7. The smart package of claim 1,wherein the package related data further comprises encrypted data forauthenticating the package.
 8. The smart package of claim 1, wherein theproduct related data includes product life/expiration data.
 9. The smartpackage of claim 1, wherein the package is a tea tumbler.
 10. The smartpackage of claim 1, wherein the package contains a scented product. 11.The smart package of claim 1, wherein the package is a foil package. 12.A smart package for use with a smart appliance for intelligentlycontrolling heating of the smart package, the smart package comprising:a container for containing known thermodynamic contents to be heated; apackage intelligence and communication module for storing andcommunicating package related pre-measured thermodynamics and packagecontent related data, the package intelligence and communication moduleincluding: (a) a storage for storing an identifier unique to thepackage; and (b) a transponder for communicating the identifier to areader on the smart appliance; the package and package content relateddata including a thermodynamic load profile representing thethermodynamic response of the package and contents to heating energy; atemperature sensor for sensing the temperature of the product during aheating operation; wherein the package includes a base having a supportfor supporting an inductive heating plate and the container includes athreaded neck, the base including the package intelligence andcommunication module therein, the base including a threaded portion forengaging the threaded neck of the container.
 13. The smart package ofclaim 12, wherein the thermodynamic load profile includes datacorrelating an expected internal temperature with power transmitted fromthe smart appliance.
 14. The smart package of claim 12, wherein theinductive heating plate is configured to insulate the package fromdirect heating allowing insulator properties to shield excess heat. 15.The smart package of claim 12 wherein the package information has beencalibrated and measured and thermodynamic performance information isincluded electronically on the package.
 16. The smart package of claim12 wherein the inductive heating plate is insulated by limiting contactwith the package using a portion of the contact area and points ofcontact or insulated with an insulating material.
 17. The smart packageof claim 12, wherein the package intelligence and communication modulecomprises a light-powered microtransponder.
 18. The smart package ofclaim 12, wherein the package related data further comprises encrypteddata for authenticating the package.
 19. The smart package of claim 12,wherein the product related data includes product life/expiration data.20. The smart package of claim 12, wherein the base is circular andwherein the package intelligence and communication module comprises alight-powered microtransponder disposed at the center of the circularbase.